Shin, Kyung-Wook: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

1

Factors associated with stigma and depressive symptoms in family members of patients with epilepsy

Lee, Sang-Ahm, Han, Su-Hyun, Cho, Yang-Je, Kim, Keun Tae, Kim, Ji-Eun, Shin, Dong Jin, Seo, Jong-Geun, Kim, Young-Soo, Ryu, Han Uk, Lee, Seo-Young, Kim, Jung Bin, Kang, Kyung-Wook, Kim, Shinhye, Kwon,

Journal:

Epilepsy & Behavior

Year:

2020

File:

PDF, 318 KB

2020

2

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - A novel double layer NCF for highly reliable micro-bump interconnection

Shin, Ji-Won, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Seo, Sun Kyung, Paik, Kyung-Wook

Year:

2014

Language:

english

File:

PDF, 2.12 MB

english, 2014

3

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Effects of thermo-compression bonding parameters on joint formation of micro-bumps in non-conductive film (NCF)

Shin, Ji-Won, Kim, Young Soon, Lee, Hyoung Gi, Kang, Un Byung, Seo, Sun Kyung, Paik, Kyung-Wook

Year:

2015

Language:

english

File:

PDF, 1.18 MB

english, 2015

4

SPIE Proceedings [SPIE SPIE Medical Imaging - Lake Buena Vista, Florida (Saturday 12 February 2011)] Medical Imaging 2011: Physics of Medical Imaging - Integration of an amorphous silicon passive pixel sensor array with a lateral amorphous selenium detector for large area indirect conversion x-ray imaging applications

Wang, Kai, Pelc, Norbert J., Samei, Ehsan, Yazdandoost, Mohammad Y., Keshavarzi, Rasoul, Nishikawa, Robert M., Shin, Kyung-Wook, Hristovski, Christos, Abbaszadeh, Shiva, Chen, Feng, Majid, Shaikh Hasi

Year:

2011

Language:

english

File:

PDF, 21.32 MB

english, 2011

5

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Effect of Pd addition on ultra-fine pitch Au wire/Al pad interface

Shin, Ji-Won, Song, Min-Suk, Park, Yong-Sung, Kwon, Yong-Min, Moon, Jeong-Tak, Cho, Jong-Soo, Yoo, Kyung-Ah, Byun, Kwan-Yoo, Joh, Cheol-Ho, Do, Eun-Hye, Paik, Kyung-Wook

Year:

2010

Language:

english

File:

PDF, 2.28 MB

english, 2010

6

Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films

Lee, Hyeong Gi, Shin, Ji-Won, Choi, Yong-Won, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2017

Language:

english

File:

PDF, 1.63 MB

english, 2017

7

Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications

Kim, Ji-Hye, Lee, Tae-Ik, Shin, Ji-Won, Kim, Taek-Soo, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 2.65 MB

english, 2016

8

Acute Spinal Injury After Centrifuge Training in Asymptomatic Fighter Pilots

Kang, Kyung-Wook, Shin, Young Ho, Kang, Seungcheol

Journal:

Aerospace Medicine and Human Performance

Year:

2015

Language:

english

File:

PDF, 601 KB

english, 2015

9

A VLSI array processor for 16-point FFT

Lee, Moon-Key, Shin, Kyung-Wook, Lee, Jang-Kyu

Journal:

IEEE Journal of Solid-State Circuits

Year:

1991

Language:

english

File:

PDF, 762 KB

english, 1991

10

Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn–Ag Microbump Interconnection

Hyeong-Gi Lee,, Yong-Won Choi,, Ji-Won Shin,, Kyung-Wook Paik,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 2.40 MB

english, 2015

11

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - 3D-TSV vertical interconnection method using Cu/SnAg double bumps

Paik, Kyung-Wook, Choi, Yongwon, Shin, Jiwon

Year:

2012

Language:

english

File:

PDF, 517 KB

english, 2012

12

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - A novel fine pitch TSV interconnection method using NCF with Zn nano-particles

Shin, Ji-Won, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Seo, Sun Kyung, Paik, Kyung-Wook

Year:

2014

Language:

english

File:

PDF, 2.65 MB

english, 2014

13

Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly

Lee, SeYong, Lee, HanMin, Shin, Ji-Won, Kim, Woojeong, Choi, Taejin, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2017

Language:

english

File:

PDF, 2.82 MB

english, 2017

14

Analysis of 3D TSV Vertical Interconnection Using Pre-applied Nonconductive Films

Choi, Yongwon, Shin, Jiwon, Suk, Kyung-lim, Kim, Young Soon, Kim, Il, Paik, Kyung-Wook

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 1.69 MB

english, 2014

15

Low-Temperature Bonding of PZT (PbZrTiO 3 ) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers

Park, Jae-Hyeong, Park, Jong Cheol, Shin, SangMyung, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

File:

PDF, 2.32 MB

2019

16

Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40μm pitch Cu-pillar/Sn–Ag bump interconnection

Shin, Ji-Won, Kim, Il, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Jee, Young Kun, Paik, Kyung-Wook

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 3.42 MB

english, 2015

17

Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

Kim, Youngsoon, Lee, Seyong, Shin, Ji-won, Paik, Kyung-Wook

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 2.35 MB

english, 2016

18

Solid-State Synthesis and Thermoelectric Properties of Cr-doped MnSi1.75−δ

Shin, Dong-Kil, Ur, Soon-Chul, Jang, Kyung-Wook, Kim, Il-Ho

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 694 KB

english, 2014

19

Synthesis and Thermoelectric Properties of Ce1−zPrzFe4−xCoxSb12Skutterudites

Song, Kwon-Min, Shin, Dong-Kil, Jang, Kyung-Wook, Choi, Soon-Mok, Lee, Soonil, Seo, Won-Seon, Kim, Il-Ho

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 1.74 MB

english, 2017

20

Does the new Korean term for epilepsy reduce the stigma for Korean adults with epilepsy?

Lee, Sang-Ahm, Han, Su-Hyun, Cho, Yang-Je, Kim, Keun Tae, Kim, Ji-Eun, Shin, Dong Jin, Seo, Jong-Geun, Kim, Young-Soo, Ryu, Han Uk, Lee, Seo-Young, Kim, Jung Bin, Kang, Kyung-Wook, Kim, Shinhye, Kwon,

Journal:

Epilepsy & Behavior

Year:

2020

File:

PDF, 329 KB

2020

21

SPIE Proceedings [SPIE SPIE Medical Imaging - Lake Buena Vista (Orlando Area), Florida, USA (Saturday 9 February 2013)] Medical Imaging 2013: Physics of Medical Imaging - Fabrication and characterization of a novel x-ray silicon detector

Shin, Kyung-Wook, Nishikawa, Robert M., Whiting, Bruce R., Karim, Karim S.

Year:

2013

Language:

english

File:

PDF, 1019 KB

english, 2013

22

SPIE Proceedings [SPIE SPIE Medical Imaging - San Diego, California, USA (Saturday 4 February 2012)] Medical Imaging 2012: Physics of Medical Imaging - Novel silicon x-ray detector with TFT readout

Shin, Kyung-Wook, Wang, Kai, Allec, Nicholas, Fang, Yuan, Karim, Karim S., Pelc, Norbert J., Nishikawa, Robert M., Whiting, Bruce R.

Year:

2012

Language:

english

File:

PDF, 546 KB

english, 2012

23

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Effect of NCFs with Zn-nanoparticles on the interfacial reactions of 40 um pitch Cu pillar/Sn-Ag bump for TSV interconnection

Shin, Ji-Won, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Jee, Young Kun, Paik, Kyung-Wook

Year:

2013

Language:

english

File:

PDF, 1.05 MB

english, 2013

24

[IEEE IEEE International Symposium on Circuits and Systems - ISCAS '94 - London, UK (30 May-2 June 1994)] Proceedings of IEEE International Symposium on Circuits and Systems - ISCAS '94 - An efficient VLSI implementation of vector-radix 2-D DCT using mesh-connected 2-D array

Kyung-Wook Shin,, Heung-Woo Jeon,, Yong-Seum Kang,

Year:

1994

Language:

english

File:

PDF, 315 KB

english, 1994

25

[IEEE 1997 IEEE International Symposium on Circuits and Systems. Circuits and Systems in the Information Age ISCAS '97 - Hong Kong (9-12 June 1997)] Proceedings of 1997 IEEE International Symposium on Circuits and Systems. Circuits and Systems in the Information Age ISCAS '97 - A complex multiplier architecture based on redundant binary arithmetic

Kyung-Wook Shin,, Bang-Sup Song,

Year:

1997

Language:

english

File:

PDF, 320 KB

english, 1997

26

[IEEE 2018 International Conference on Electronics, Information, and Communication (ICEIC) - Honolulu, HI, USA (2018.1.24-2018.1.27)] 2018 International Conference on Electronics, Information, and Communication (ICEIC) - An efficient implementation of SHA processor including three hash algorithms (SHA-512, SHA-512/224, SHA-512/256)

Lee, Sang-Hyun, Shin, Kyung-Wook

Year:

2018

Language:

english

File:

PDF, 903 KB

english, 2018

27

SPIE Proceedings [SPIE SPIE Medical Imaging - San Diego, California, USA (Saturday 4 February 2012)] Medical Imaging 2012: Physics of Medical Imaging - Performance of a prototype 32×32 pixel indirect x-ray imager based on a lateral selenium passive pixel sensor

Keshavarzi, Rasoul, Wang, Kai, Yazdandoost, Mohammad Y., Shin, Kyung-Wook, Chen, Feng, Majid, Shaikh Hasibul, Abbaszadeh, Shiva, Karim, Karim S., Pelc, Norbert J., Nishikawa, Robert M., Whiting, Bruce

Year:

2012

Language:

english

File:

PDF, 1.14 MB

english, 2012

28

[IEEE 2016 IEEE Nuclear Science Symposium, Medical Imaging Conference and Room-Temperature Semiconductor Detector Workshop (NSS/MIC/RTSD) - Strasbourg, France (2016.10.29-2016.11.6)] 2016 IEEE Nuclear Science Symposium, Medical Imaging Conference and Room-Temperature Semiconductor Detector Workshop (NSS/MIC/RTSD) - FASPAX: A fast, integrating detector for the APS-upgrade

Shin, Kyung-Wook, Bradford, Rebecca, Baldwin, Jonathan, Braga, Davide, Deptuch, Gregory, Fahim, Farah, Madden, Tim, Zimmerman, Tom

Year:

2016

File:

PDF, 700 KB

2016

29

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - A study on the 3D-TSV interconnection using wafer-level non-conductive adhesives (NCAs)

Choi, Yongwon, Shin, Jiwon, Paik, Kyung-Wook

Year:

2011

Language:

english

File:

PDF, 1.36 MB

english, 2011

30

Hydrogenated Nanocrystalline Silicon Thin Film Transistor Array for X-ray Detector Application

Shin, Kyung-Wook, Esmaeili-Rad, Mohammad R., Sazonov, Andrei, Nathan, Arokia

Journal:

MRS Proceedings

Year:

2008

Language:

english

File:

PDF, 518 KB

english, 2008

31

[IEEE 2015 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC) - San Diego, CA, USA (2015.10.31-2015.11.7)] 2015 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC) - Optimizing floating guard ring designs for FASPAX N-in-P silicon sensors

Shin, Kyung-Wook, Bradford, Robert, Lipton, Ronald, Deptuch, Gregory, Fahim, Farah, Madden, Tim, Zimmerman, Tom

Year:

2015

Language:

english

File:

PDF, 634 KB

english, 2015

32

The Effect of the Thermal Mechanical Properties of Non-Conductive Films (NCFs) on the Thermal Cycle Reliability of 40 μm Fine Pitch Cu-pillar/Ni/SnAg Micro Bump Flip Chip Assembly

Lee, SeYong, Park, JongHo, Park, Jae-Hyeong, Lee, HanMin, Shin, SangMyung, Kim, Youngsoon, Kim, Woojeong, Choi, Taejin, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 1.33 MB

english, 2018

33

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Effects of the Curing Properties and Viscosities of Non-Conductive Films (NCFs) on the Sn-Ag Solder Bump Joint Morphology and Reliability

Lee, HanMin, Lee, SeYong, Shin, SangMyung, Choi, TaeJin, Park, SooIn, Paik, Kyung-Wook

Year:

2019

File:

PDF, 671 KB

2019

34

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - A Study on the Double Layer Non Conductive Films (NCFs) for Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection

Lee, SeYong, Shin, Ji-Won, Lee, Hyeong Gi, Kim, Young Soon, Paik, Kyung-Wook

Year:

2016

Language:

english

File:

PDF, 1.03 MB

english, 2016

35

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Effects of the Materials Properties of Epoxy Molding Films (EMFs) on Fan-Out Packages (FOPs) Characteristics

Shin, Sangmyung, Lee, Hanmin, Kim, JunMo, Lee, Tae-Ik, Kim, Taek-Soo, Kyung, Youjin, Jeong, Minsu, Lee, Kwangjoo, Paik, Kyung-Wook

Year:

2019

File:

PDF, 328 KB

2019

36

Midterm and Long-term Results of Medial Versus Lateral Meniscal Allograft Transplantation: A Meta-analysis

Bin, Seong-Il, Nha, Kyung-Wook, Cheong, Ji-Young, Shin, Young-Soo

Journal:

American Journal of Sports Medicine

Year:

2017

Language:

english

File:

PDF, 2.43 MB

english, 2017

37

A 200-MHz complex number multiplier using redundant binary arithmetic

Kyung-Wook Shin, Bang-Sup Song, Bacrania, K.

Journal:

IEEE Journal of Solid-State Circuits

Year:

1998

Language:

english

File:

PDF, 187 KB

english, 1998

38

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - 3D-TSV vertical interconnection method using Cu/SnAg double bumps and B-stage non-conductive adhesives (NCAs)

Choi, Yongwon, Shin, Jiwon, Paik, Kyung-Wook

Year:

2012

Language:

english

File:

PDF, 637 KB

english, 2012

39

[IEEE 2019 International Conference on Electronics, Information, and Communication (ICEIC) - Auckland, New Zealand (2019.1.22-2019.1.25)] 2019 International Conference on Electronics, Information, and Communication (ICEIC) - A Hardware Implementation of SHA3 Hash Processor using Cortex-M0

Kim, Dong-Seong, Lee, Sang-Hyun, Shin, Kyung-Wook

Year:

2019

Language:

english

File:

PDF, 429 KB

english, 2019

40

Factors associated with social anxiety in South Korean adults with epilepsy

Han, Su-Hyun, Kim, Keun Tae, Ryu, Han Uk, Lee, Sang-Ahm, Cho, Yang-Je, Kim, Jee Hyun, Kang, Kyung-Wook, Shin, Dong Jin, Lee, Gha Hyun, Hwang, Kyoung Jin, Kim, Young-Soo, Kim, Jung Bin, Kim, Ji-Eun, Le

Journal:

Epilepsy & Behavior

Year:

2019

Language:

english

File:

PDF, 318 KB

english, 2019

41

High-speed complex-number multiplications based on redundant binary representation of partial products

Shin, Kyung-Wook, Jeon, Heung-Woo

Journal:

International Journal of Electronics

Year:

2000

Language:

english

File:

PDF, 880 KB

english, 2000

42

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Reliability improvement of solder anisotropic conductive film (ACF) joints by controlling ACF polymer resin properties

Kim, Yoo-Sun, Kim, Seung-Ho, Shin, Jiwon, Paik, Kyung-Wook

Year:

2015

Language:

english

File:

PDF, 1.34 MB

english, 2015

43

Survival of total knee arthroplasty after high tibial osteotomy versus primary total knee arthroplasty

Seo, Seung-Suk, Nha, Kyung-Wook, Kim, Tae-Yeong, Shin, Young-Soo

Journal:

Year:

2019

File:

PDF, 1.60 MB

2019

44

SPIE Proceedings [SPIE SPIE Medical Imaging - San Diego, California, USA (Saturday 13 February 2010)] Medical Imaging 2010: Physics of Medical Imaging - Cadmium zinc telluride detector for low photon energy applications

Shin, Kyung-Wook, Samei, Ehsan, Pelc, Norbert J., Wang, Kai, Reznic, Alla, Karim, Karim S.

Year:

2010

Language:

english

File:

PDF, 5.51 MB

english, 2010

45

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - A study on the fine pitch chip interconnection using Cu/SnAg bumps and B-stage non-conductive films (NCFs) for 3D-TSV vertical interconnection

Choi, Yongwon, Shin, Jiwon, Kim, Young Soon, Suk, Kyung-lim, Kim, Il, Paik, Kyung-Wook

Year:

2014

Language:

english

File:

PDF, 2.12 MB

english, 2014

46

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Effects of pad surface finish on interfacial reliabilities of Cu-pillar/Sn-Ag bumps of 2.5D TSV-enterposer on PCB applications

Kim, Youngsoon, Shin, Ji-won, won Choi, Young, Paik, Kyung-Wook

Year:

2014

Language:

english

File:

PDF, 949 KB

english, 2014

47

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Ultra-thin chip-in-flex (CIF) technology using anisotropic conductive films (ACFs) for wearable electronics applications

Kim, Ji-Hye, Lee, Tae-Ik, Shin, Ji-Won, Kim, Taek-Soo, Paik, Kyung-Wook

Year:

2015

Language:

english

File:

PDF, 1.63 MB

english, 2015

48

Practice patterns of retrievable inferior vena cava filters and predictors of filter retrieval in patients with pulmonary embolism

Kang, Jieun, Ko, Heung-Kyu, Shin, Ji Hoon, Ko, Gi-Young, Jo, Kyung-Wook, Huh, Jin Won, Oh, Yeon-Mok, Lee, Sang-Do, Lee, Jae Seung

Journal:

Vascular Medicine

Year:

2017

Language:

english

File:

PDF, 358 KB

english, 2017

49

[IEEE 2020 International Conference on Electronics, Information, and Communication (ICEIC) - Barcelona, Spain (2020.1.19-2020.1.22)] 2020 International Conference on Electronics, Information, and Communication (ICEIC) - A Self-Timed Ring based TRNG with Feedback Structure for FPGA Implementation

Choe, Jun-Yeong, Shin, Kyung-Wook

Year:

2020

File:

PDF, 440 KB

2020

50

SPIE Proceedings [SPIE SPIE Medical Imaging - San Diego, California, USA (Saturday 13 February 2010)] Medical Imaging 2010: Physics of Medical Imaging - Lateral amorphous selenium metal-semiconductor-metal photodetector for large-area high-speed indirect-conversion medical imaging applications

Wang, Kai, Samei, Ehsan, Pelc, Norbert J., Chen, Feng, Shin, Kyung-Wook, Allec, Nicholas, Karim, Karim S.

Year:

2010

Language:

english

File:

PDF, 1.14 MB

english, 2010

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@1delivery.pm

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски